Cu-bonded ceramic substrates, as essential components of high-voltage, high-power IGBT modules, combine the advantages of ceramics, such as high thermal conductivity, high electrical insulation, and high mechanical strength, with the high electrical conductivity and excellent welding performance of oxygen-free copper. They are also capable of producing various patterns, making them suitable as packaging materials for SiC chips, high-power IGBT modules, and semiconductor cooling and heating devices.
DCB (direct copper bonding) is an electronic base material formed by directly sintering copper foil onto a ceramic surface. It has excellent thermal cycling performance, high mechanical strength, high thermal conductivity, high insulation, and the capability to carry large currents.
AMB is an advanced development of the DBC (Direct Bonded Copper) method. It uses small amounts of active elements, such as titanium (Ti) and zirconium (Zr), in the brazing material. These active elements react with the ceramic to form a reaction layer that allows the molten brazing material to wet the ceramic, thus enabling the bonding of ceramic and metal.
The DPC (direct plate copper) process is able to promise ultimate precision in products, with its primary technique involving magnetron sputtering to plate copper onto the substrate. This is followed by surface treatment to improve the substrate’s solderability and anti-oxidation properties, enabling the creation of fine lines, better flatness, and stronger adhesion.
DAB（Direct Aluminum Bonded）substrate produced by Ferrotec are ideal packaging materials for high-voltage, high-current power devices thanks to their strong thermal shock resistance, superior reliability, and excellent thermal conductivity, making them suitable for thicker ceramic substrates and high-voltage insulation environments. The substrates have been applied in hybrid electric vehicles and industrial inverters. The substrates also effectively support the development of industries like wind power, electric vehicles, and rail transport, especially in areas like thermal cycling, heating cycles, and low thermal resistance.
