DCB (direct copper bonding) is an electronic base material formed by directly sintering copper foil onto a ceramic surface. It has excellent thermal cycling performance, high mechanical strength, high thermal conductivity, high insulation, and the capability to carry large currents.
Remove particles and contaminants from the surface of the raw materials to prepare them for subsequent copper oxidation and sintering processes.
A layer of uniform copper oxide is formed on the copper surface using a specific method, after which the copper is bonded with the ceramic.
Using specialized patterning techniques in which patterns are transferred onto the copper surface and then etched to create various designs.
The copper surface undergoes chemical nickel, gold, silver, or other surface plating treatments.
The ceramic material is laser cut into different sizes.
Finished products are inspected for appearance and performance, then vacuum-packed before being delivered to customers.
