AMB is an advanced development of the DBC (Direct Bonded Copper) method. It uses small amounts of active elements, such as titanium (Ti) and zirconium (Zr), in the brazing material. These active elements react with the ceramic to form a reaction layer that allows the molten brazing material to wet the ceramic, thus enabling the bonding of ceramic and metal.
Remove particles and contaminants from the surface of the raw materials to prepare them for subsequent copper oxidation and sintering processes.
Using specialized patterning techniques in which patterns are transferred onto the copper surface and then etched to create various designs.
The copper surface undergoes chemical nickel, gold, silver, or other surface plating treatments.
The ceramic material is laser cut into different sizes.
Finished products are inspected for appearance and performance, then vacuum-packed before being delivered to customers.
